are a dielectric plate laminated with copper foil.

Substances-compounds can be either foiled from one or both sides or not foiled.

Essentially, these materials are an integral structure of compounds which have different chemical and physical parameters.

Types:

— Ceramic.
— Silicon, as well as compounds based on silicon oxide.
— Enameled/oxidized metals. The most popular are aluminum.

Basic inorganic materials have significant factors of heat conduction, resistance to temperature fluctuations.

At the same time the coefficient factors of the thermal expansion are close to zero or negative. They are used as components capable of operating under harsh operating conditions.

Binding compounds:

— Phenolic/epoxy resins.
— Polyimide.

It is applied in Rogers HDI boards. It is often combined with aramid paper and epoxy resins. The material can be etched, and laser drilled well, it is possible to make transition vias by chemical methods.

It is a widespread basic material. It is simple in operation and has different thicknesses of weaving. It is used in FR-4.

It is used in combination with fluoroplastics or epoxy compounds. It is a base for CEM-III.

Chemical origin

Organic

Organic basic materials consist of a base and some binding compound.

They have a low dielectric constant, an insignificant angle tangent of the dielectric loss. Their price is available. They are used in household, industrial (specialized) equipment.

Types of organic materials base:

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