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Basic material: polyimide

Polyimide (polyimide films) is a high temperature, antifriction material. It obtains low rates of friction and creep process. The main purpose: basic material for HDI boards (it is used in combination with reinforced paper and epoxy resin).

Polyimide can easily be etched, laser-drilled, metallized. It is quickly processed by chemical methods of creating vias. Color: from light yellow to bright orange.
— Thermal and chemical stability.
— A high resistance to mechanical damage.
— After fiberglass/carbon reinforcement polyimide can be used as a composite.
— High strength characteristics of tension and break.
— A wide temperature operation mode: from -200˚ to + 400˚.
— It is not affected by most solvents/oils, including weak acids, compound alcohol-containing solutions, hydrocarbons, ethers and freons. The only restriction is the application in alkaline and acid (inorganic) media. Resistant to radiation.
Home electronics and portable devices
Sources of synchronous radiation
Equipment for high-temperature/high-voltage insulation of electrical circuits
Flexible and rigid boards

— PM-1. It is made from a solution of dimethylformamide by coating. Such films are transparent (the color varies depending on the thickness of the plate: from light yellow to dark brown). The material has high mechanical and physical properties, retains elasticity in a wide temperature range (from -60˚ to + 220˚).

— PMF is a composite material made on the basis of polyimide PM-1 (30−100 micron thick) and a layer/layers of fluoroplastic (5−10 micron thick). Operation temperatures: from -60˚ to + 200˚, maximum atmosphere pressure is 7 GPa. It can be welded.

— PM-K -electrically-conductive. The material contains microparticles of dispersed soot. It preserves the initial characteristics at temperatures from -200˚ to + 250˚. It can withstand short-term use at + 400˚.

— PM-EU. It has an additional layer of heat-treated protective lacquer. The feature: 2% shrinkage at 350 ° C.

— Non-shrinkage materials. Polyimide is subjected to thermal stabilization during its production. As a result, such material has minimal shrinkage (<0.05%) at + 200 °. It contributes to lamination, gluing, and metalizing processes.

— PM-RD. This material as a heat-sealable coating and is produced by repeated application of adhesive lacquers on one or several sides. Then the polyimide undergoes heat treatment.

— PEI -polyetherimide. It is produced with the addition of a polyester solution and n-methylpyrrolidone. It is thermoplastic. Color: from white to dark grey.

— PM-U -heat shrinkable. It is produced by a high-temperature method of orientation stretching. Shrinkage rates: 2−15%.
Breaking strength, MPa
Relative elongation at break,%
Modulus of elasticity (tension), MPa
Dielectric capacitivity, kHz
Electric strength, kV/mm
Dielectric loss angle tangent, kHz
Specific electrical resistance, Ohm m
Heat transfer, W/m K
Heat capacity, J/kg K
Index of linear heat expansion, 1015
Adhesion strength, g/cm