Polyimide (polyimide films) is a high temperature, antifriction material. It obtains low rates of friction and creep process. The main purpose: basic material for HDI boards (it is used in combination with reinforced paper and epoxy resin).

Polyimide can easily be etched, laser-drilled, metallized. It is quickly processed by chemical methods of creating vias. Color: from light yellow to bright orange.

— Thermal and chemical stability.
— A high resistance to mechanical damage.
— After fiberglass/carbon reinforcement polyimide can be used as a composite.
— High strength characteristics of tension and break.
— A wide temperature operation mode: from -200˚ to + 400˚.
— It is not affected by most solvents/oils, including weak acids, compound alcohol-containing solutions, hydrocarbons, ethers and freons. The only restriction is the application in alkaline and acid (inorganic) media. Resistant to radiation.

— Home electronics and portable devices
— Sources of synchronous radiation
— Equipment for high-temperature/high-voltage insulation of electrical circuits
— Flexible and rigid boards

— PM-1. It is made from a solution of dimethylformamide by coating. Such films are transparent (the color varies depending on the thickness of the plate: from light yellow to dark brown). The material has high mechanical and physical properties, retains elasticity in a wide temperature range (from -60˚ to + 220˚).

— PMF is a composite material made on the basis of polyimide PM-1 (30−100 micron thick) and a layer/layers of fluoroplastic (5−10 micron thick). Operation temperatures: from -60˚ to + 200˚, maximum atmosphere pressure is 7 GPa. It can be welded.

— PM-K -electrically-conductive. The material contains microparticles of dispersed soot. It preserves the initial characteristics at temperatures from -200˚ to + 250˚. It can withstand short-term use at + 400˚.

— PM-EU. It has an additional layer of heat-treated protective lacquer. The feature: 2% shrinkage at 350 ° C.

— Non-shrinkage materials. Polyimide is subjected to thermal stabilization during its production. As a result, such material has minimal shrinkage (<0.05%) at + 200 °. It contributes to lamination, gluing, and metalizing processes.

— PM-RD. This material as a heat-sealable coating and is produced by repeated application of adhesive lacquers on one or several sides. Then the polyimide undergoes heat treatment.

— PEI -polyetherimide. It is produced with the addition of a polyester solution and n-methylpyrrolidone. It is thermoplastic. Color: from white to dark grey.

— PM-U -heat shrinkable. It is produced by a high-temperature method of orientation stretching. Shrinkage rates: 2−15%.

Breaking strength, MPa

70−180

Relative elongation at break,%

15−90

Modulus of elasticity (tension), MPa

3000−3500

Dielectric capacitivity, kHz

3−3,5

Electric strength, kV/mm

120−270

Dielectric loss angle tangent, kHz

0,0025−0,003

Specific electrical resistance, Ohm m

10^14−10^15

Heat transfer, W/m K

0,14−0,2

Heat capacity, J/kg K

10^14−10^15

Index of linear heat expansion, 1015

20−30

Adhesion strength, g/cm

150−250