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Basic Material: Aluminum

Aluminum base (Al base) is a high-tech compound designed to produce printed circuit boards and components with high heat release rates. In addition, the material Al base has high strength characteristics and withstands significant mechanical and vibration loads.

Aluminum is produced in the form of sheets separated by copper. Essentially the basic material is a one-sided printed circuit board which is pasted to an aluminum plate.
— LED-based lighting equipment: lamps, searchlights and tapes, garlands and flashlights
— Automobile electronics
— Voltage converters and power supplies
— Communication devices
The boards are made on oxidized aluminum sheets with a copper foil pasted over it. The feature: there is no possibility to make transition vias — such PCB are single-layer.

The boards are processed by chemical methods. As a basis an elastic aluminum alloy (5052) alloyed with chromium and magnesium is used in the percentage content 0.15−0.35% and 2.2−2.8%, respectively. Foil fiberglass, pre-impregnated with epoxy resin, is used as a bond ply (dielectric layer).

The heat conduction of the entire printed circuit board is from 0.8−10 W/m∙K.
The heat generated from the components passes quickly through the dielectric plate and it is easily dissipated over the reliably pasted radiator - an aluminum base.
Parameters
ChaoShun [CCAF-01]
ChaoShun [CCAF-04]
ChaoShun [CCAF-05]
Thickness:
— of aluminum base, mm
1,5
1,5
0,8−2
— of copper layer, μm
18, 35, 70
35
18, 35, 70
— of dielectric, μm
70
80
60-200
Inflammability
FV-O
FV-O
FV-O
Glass transition temperature, ˚С
125
125
125
Volume resistivity, Mω/m /m
4∙10^8
10^8
4,2∙10^8
Specific surface resistance, Mω/m
5∙10^7
5∙10^7
3,68∙10^7
Index of the dielectric constant
4,2
4,2
4,24
Temperature resistance, ˚С/W
1
0,65
0,45
Index of thermal resistance at soldering 288 ° C, 2 minutes
There is no blistering defect
There is no blistering defect
There is no blistering defect
Bow/Torsion, %
0,8
0,8
0,8
Moisture absorption, %
0,061
0,061
0,061
Coefficient of heat conduction, W/mm ∙ K
1
1,5
2,2
Dielectric breakdown, KW
2,2
2,5
4,8
Tearing strength, N/mm
2
1,9
1,08
Dielectric loss angle tangent, MHz
0,02
0,029
0,033
Sheet size, mm
From 300×500, to 1220×640
From 300×500, to 1220×640
From 300×500, to 1220×640
Operational temperature of the protective coating, ˚С
From 80
From 80
From 80