Due to the industrial growth and increasing complexity of electronic devices all over the world, including Russia, there is a growing demand for multilayer printed circuit boards.

Large-scale manufacturers have practically abandoned other, simpler boards in favour of multilayer boards. This is because the latter have greater capabilities and improved performance.

Because of this popularity and increased demand, MPBs have evolved to the point where they require no more material than single- and double-layer ones. But the cost of multilayer boards is still much more expensive due to the peculiarities of the manufacturing process - the complexity of testing, packaging density of electronic components and so on.

Despite the high cost of MPBs they are popular due to the following advantages over their double and single-layer counterparts:

Despite the high cost of MPBs they are popular due to the following advantages over their double and single-layer counterparts:
— High component density, which results in significantly lower board size and weight;
— Combination of various materials and technologies in the case of flex-rigid MPBs allows for greater robustness and ease of installation;
— Durability and reliability.

In order to fabricate a costly PCB without any problems and to meet your specifications, you may contact Sai Fon Technologies which can design, test and manufacture PCBs in the required volume.

Alongside conventional multilayer boards, high-density multilayer printed circuit boards, which offer increased trace density by reducing the overall width of the conductors as well as the gaps between the conductors, are also gaining popularity.

Via-holes for HDI boards

But via holes, because of the need for metallization and for structural strength, have to be made quite massive in size.

Their thickness is of course measured in millimeters, but for high-density boards a few millimeters makes a huge difference, which is why hidden and deaf vias are now used in such cards.

Deaf vias are links between the outer layer of a multilayer printed circuit board and several layers below. In a sandwich analogy - imagine that in a sandwich with three loaves, a skewer would pass from the middle slice of bread and come out through the top one to the outside of the sandwich. There is access through one of the outer layers.

Plugged, deaf, or as they are also called "buried" and "hidden" holes are the via-holes between the inner layers of the printed circuit board. They are not accessible after installation.

The use of both types of holes is justifiable in cases where very dense wired interconnections are involved or for devices with very dense packaging of planar components on the outer layers of the board. But the more sophisticated the PCB and the device, the greater the need for such vias.

When it comes to the production of HDI printed circuit boards, specialists with higher qualifications are required. It is therefore important to entrust the development to professionals who have received the appropriate training. Sai Fon Technologies has been developing boards of any complexity, including HDI boards, for many years.