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Basic material: fiberglass

Fiberglass is a laminated pressed composite material. It is made of two or more parallel layers, impregnated with a polymer (thermosetting) resin. It is easily stamped/machined. Depending on the purpose, the basic material can be either structural or electrotechnical.
— Safe, environmentally friendly material.
— High mechanical/dielectric values.
— Excellent resistance to aggressive chemical media, moisture, and temperature fluctuations.
— Durable: average service life - 20 years.
It is used to produce both double-layer and MPB of high strength in the following areas:
— Metal industry
— Shipbuilding
— Electrical and radio engineering
— Aviation equipment and components for missiles
— Standard — FR-4
The vitrification temperature is 130 °C. There is UV protection — UV blocking. It is the most common type of fiberglass, low-cost.

— With high temperature values of vitrification
The vitrification temperature varies from 170˚ to 200˚. Unlike standard FR-4, high-temperature dielectric substrates have via holes of higher quality (by 1.8%) and more tolerance on thickness (by 3%). The total quantity of resin spots is reduced by 12%, compared to standard materials. They are easy-processing and resistant to chemical reagents.

— Halogen-free
Basic halogen-free materials are compatible with lead-free tinning and soldering. Flammability class: UL94-V0.
The standard fiberglass of FR-4 specification is 1.6 mm thick, and it contains 8 prepreg layers. The fourth (central) layer has the manufacturer’s logo, and its color indicates the assignment of a flammability class. For example, blue color indicates the flammability class UL94-HB (the mounting substrate is not fireproof), red — UL94-V0 (fireproof material).

The real color of FR-4 is transparent, green tint appears on the printed circuit board only after the application of the soldermask.
Parameters
Standard
Halogen-free
High-temperature
Specific volume resistance, MΩ / cm
1,9∙10^8
10^7−5∙10^7
10^15−5∙10^15
Specific surface resistance, MΩ
3,8∙10^7
10^8−5∙10^8
10^14−5∙10^14
Index of the dielectric constant
4,8
5,2
4,7
Dispersion coefficient
0,018
0,01
0,015
Index of thermal resistance at soldering 288 °C, sec
Not more than 20
Less than 120
Less than 120
Peel resistance coefficient, kN/m
1,43−1,81
1,86
1,96
Dielectric breakdown, HF
Not more than 50
Not more than 50
Not more than 50
Bending strength, N mm2
490
490
490
Insulation resistance
10^7−10^8
10^7−10^8
10^13-10^14

Vitrifaction temperature, °C
130
130
170−200