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Saifon ECO
What we do
Base materials classification
Common PCBs issues
PCB ABC-book
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Manufacturers of electronic components
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In any high-tech output, product quality control
is required allowing us to give customers a quality guarantee and not use defective printed circuit boards.
Saifon Technologies performs electrical testing to identify all the minor flaws in the production process – short circuits, breakages, and mismatches in current resistance on the surface.
Testing takes place at the last stage of printing circuit boards.
How we test
In the course of testing, electrical connections are checked at the locations of the output points of the circuits and in the contact areas and the integrity of the conductors is also checked. The possibility of short circuits is avoided.

As a result, manufacturing defects are excluded. Printed circuit boards that have passed the test perfectly are ready for shipment to the end buyer.
The time of checking products depends significantly on the number of layers on the board, the availability of additional functions, and the specifics of a particular model. It usually takes one day.
  1. When the area of printed circuit boards is less than 500 dm², the Flying Probe method is used;
  2. If the circuit board area is more than 500 dm², an adapter method is used, which will be more economically correct.
Several types of testing are suitable for different situations:
Since multilayer printed circuit boards are very complex devices, it is impossible to test them quickly.
Testing of multilayer printed circuit boards
The methods described above find KEPI with short-circuited layers and conductors, but it is impossible to determine their exact location in the circuit boards by them. And since the cost of multilayer boards can be extremely high, it is not cost-effective to reject an entire board because of one defective part.

There is special modern equipment that uses the “vector search” method. Such a device supplies a voltage to the area with the alleged malfunction, with the help of which changes in the flowing current are monitored, and, based on this, it is revealed where precisely the defect is located. The accuracy of such a device reaches milliamps, microvoltmeters, and milliohmmeters.