Additional difficulties may arise when either a board with an individual, non-standard shape is required, or with small-sized boards.

In this case, the gripper manipulators, devices for soldering and installing parts, and other equipment will not be able to work with the product.

So, panelization comes to the rescue.

Panelization (or otherwise multiplication) is a manufacturing method when a whole batch of printed circuit boards is made in a single layer.

What is panelization and why is it needed?

For PCBs of non-standard shape

For too small PCBs

And since in this case a whole batch of products can be created at once, this method allows to save money. This method is especially relevant for one-sided and two-sided structures. Saifon Technologies uses a similar method, making the production cheaper, and, consequently, reducing their final cost.

It goes through a part of the production in this form and then the boards are disconnected for further work.

PCBs in an undivided form can be processed up to tests.

So, panelization is required:

But the cost is reduced only if all the PCBs on one panel are identical to each other. Otherwise, an additional fee may even be charged for this method.

As the name implies, de-panelization is the process of separating printed circuit boards from each other.

How de-panelization is performed?

At this stage, it is important to avoid errors, otherwise the entire batch of products may immediately become defective. Errors can damage both the entire boards and individual components on them.

Therefore, three best and most common methods of panelization have been worked out. We use all these methods in Saifon Technologies. One of them implies V-shaped grooves in "cut" areas, and two - milling along the contour.

Of course, at the development stage, the designer can make changes to the standard de-panelization system and make things in the most convenient way for a particular production method. The main thing is that the method can be carried out without problems in current conditions and with existing equipment at the enterprise.

For the second method:

For the second method, contour milling is performed for each board in the panel. Only special jumpers remain, which combine the boards together. This fastening makes it easy to de-panelize the boards, but it is not suitable in cases where PCBs have large, heavy-weight components. At the same time, this method simultaneously reduces the load on each board.

The method with V-shaped grooves

Paneling with additional milling of jumpers

Means that the boards are separated from each other by a groove that goes deep into the board by a third of its height. For this type of multiplication, PCBs must meet three criteria: no hinged elements; no rounded corners; some distance from the edge of the board to any component on it. The disadvantage of this option is the probability of sagging and breakdowns of PCBs due to the load on the center of the panel due to the design features.

The method is similar to the previous one, but jumpers have drilled holes that facilitates separation. However, the holes reduce the permissible load level, so the method should be used with caution.

Saifon Technologies has extensive experience and chooses the most suitable option PCB manufacturing, taking into account the cost, time and other production parameters.

Each method, as we found out, has its own individual drawbacks. But apart from them, the method of such production has the following pitfalls:

Problems with protruding parts. In mass production, even when using the third method, separating the boards with some protruding elements will lead to unnecessary time;

Dust. With any method, the separation of the boards is not a "clean" process. To remove the dust that occurs after de-panelization, you will have to use additional equipment.