Saifon Technologies offers a wide selection of active and passive elements for embedding. The company can fulfill any order, but the embedding decision should be made at the early stages of development. If it is impossible to change the process, we are ready to create an individual project to meet your requirements.
The need for integration, packing density, as well as improved functionality and miniaturization are the main requirements at the moment. To solve these problems, there is a method of embedding components inside the board structure.
The approach to the PCB design largely depends on the market changing requirements.
Methods traditionally used, such as placing components on the upper and lower sides of PCB, cannot be adapted to modern conditions in some cases.