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Saifon ECO
What we do
Base materials classification
Common PCBs issues
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Manufacturers of electronic components
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IMS — insulated metal base printed circuit boards
Boards with a built-in heat sink (IMS) are optimal cost alternative to glass-ceramic models.

The main purpose of metal base printed circuit boards: operation in hard conditions of thermal effect.

In addition, the contours of heat-conducting plates are easy to process, the material is quite durable and has wear-resistant properties with respect to mechanical and vibration effects.
— Availability of electromagnetic shielding indicators.
— Resistance to mechanical stress, as well as vibration fields.
— High heat-conducting properties.
— Power modules
— Equipment that functions in high—temperature conditions
— High heat dissipation LEDs
— Printed circuit boards of converters (DC|DC)
— About materials
Printed circuit boards on a metal base are made of aluminum alloys, steel or copper. The main list of materials used includes:
— T-Clad Bergquist and T-111 Totking.
— Ruikai Aluminum IMS/LED and Laird Technologies T-Preg/T-Lam.
— Arlon 92ML/99ML and HiTg FR4.

— Structure
The topology of the conductors is applied with a heat-conducting dielectric of the pressed structure on a metal base. As a result, the dielectric layer becomes electrically insulated and contributes to the redistribution of heat between the components and the main plate.

The thickness of the support of the printed circuit board varies from 70 microns to several millimeters and depends on the required technological parameters:
— the amount of heat released by equipment components;
— diffusion/transfer of the cooling system;
— voltage coefficient on breakdown.

— Design tip
Both single-layer and multi-layer models (up to 24 layers) are produced. The conductive pattern can be applied on one or both sides of the base of the printed circuit board.

— Production technology
Feature: application of metal bases of large heat conductivity. In addition, the boards topology is applied either by the subtractive or by the tenting method (when forming several wire layers).
Technical parameters