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Electronics news

MacDermid Alpha at NEPCON Japan 2024

MacDermid Alpha, one of the world's largest solution providers for PCB, assembly and semiconductor manufacturers, exhibited at the 38th NEPCON Japan electronics, research and manufacturing technology exhibition.

The event runs from January 24-26, 2024 at the Tokyo International Exhibition Center.

At booth E35-48, MacDermid Alpha showcased its integrated solutions that enable device designers and manufacturing engineers to meet the ever-changing and demanding requirements of the semiconductor industry. Innovative technologies centered around ViaForm, Argomax, Electrolube and the ALPHA HiTech product lines.

1. Silver sintering pastes for flexibility and ease of use, high thermal and electrical performance from Argomax.
2. a wide range of electronics chemistries including conformal coatings, sealants and thermal management materials from Electrolube.
3. lines of high-performance adhesives, fillers, edge bonds and sealants to enhance structural integrity and reliability from ALPHA HiTech Polymer Reinforcement Solutions.

Attendees will have the opportunity to speak with MacDermid Alpha's experienced technical support staff and learn about technologies that will enable designers and engineers to improve the performance, reliability and sustainability of their products.