We use cookies. They help to improve your interaction with the site.
Ok
Electronics news

New congatec-HPC/3.5-Mini 3.5-inch carrier board

The new conga-HPC/3.5-Mini 3.5-inch carrier board is designed for high-performance IIoT applications based on COM-HPC Mini modules with extended temperature support from -40°C to + 85°C.

There are two options for purchasing the new commercial-off-the-shelf (COTS) carrier board. As a pure application board with the conga-HPC/mRLP module, the COM-HPC Mini is an ideal platform for series products starting with small batches. For application-oriented designs, the complete aReady suite provides high design convenience and security. For example, possible configurations can include a pre-installed ctrlX OS from Bosch Rexroth and virtual machines for tasks such as real-time control, HMI, AI, IIoT communication, maintenance and management functions.

Both options are suitable for OEMs wishing to develop sustainable system designs based on off-the-shelf components. COTS modular configurations are primarily targeted at OEMs and system integrators. The sustainability of the solution is ensured by the ability to replace only a module when performance and functionality requirements change, rather than the entire embedded hardware.

Representing a modular, application-specific embedded computing platform in a 3.5-inch format, both offer an excellent technology foundation for rapid prototyping and balancing price/performance through processor selection.