Review common causes of PCB deformation, discuss the impact of depanelization, and give practical advice to design engineers on how to minimize problems.
Common causes of PCB deformation are:
1. Component placement on the PCB. Heavy or oversized components contribute to uneven stress distribution, resulting in bending or warping of boards.
2. Board materials and thickness. Relatively thin boards are more prone to warping.
3. Mechanical stresses from soldering, component placement, and depanelization: milling, V-banding, or laser cutting.
Tips for minimizing PCB deformation:
1. Component placements on the board - evenly distribute mass and minimize stress. Consider supporting large or heavy components, such as with a mechanical standoff or additional solder for components with through-holes.
2. Select appropriate board materials and thicknesses.
3. Proper routing methods. Avoid tracks at right angles. Use curved or beveled angles. Provide proper spacing between tracks.
4. use fiducial markings. They help assemblers accurately align components, reducing mechanical stress during placement.
5. Selecting the appropriate depanelization method based on PCB design and material properties.
1. Component placement on the PCB. Heavy or oversized components contribute to uneven stress distribution, resulting in bending or warping of boards.
2. Board materials and thickness. Relatively thin boards are more prone to warping.
3. Mechanical stresses from soldering, component placement, and depanelization: milling, V-banding, or laser cutting.
Tips for minimizing PCB deformation:
1. Component placements on the board - evenly distribute mass and minimize stress. Consider supporting large or heavy components, such as with a mechanical standoff or additional solder for components with through-holes.
2. Select appropriate board materials and thicknesses.
3. Proper routing methods. Avoid tracks at right angles. Use curved or beveled angles. Provide proper spacing between tracks.
4. use fiducial markings. They help assemblers accurately align components, reducing mechanical stress during placement.
5. Selecting the appropriate depanelization method based on PCB design and material properties.