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Electronics news

Samsung is moving steadily toward foundry technology for 1.4nm chips to compete with TSMC

At the annual Foundry Forum in San Jose, California, the South Korean technology giant said it will start providing manufacturing services for next-generation power management chips for automotive applications, including electric vehicles, from 2025.

In 2026, the company plans to apply the advanced technology in 2nm chips for high-performance computing (HPC). Looking ahead, Samsung confirmed its plans to begin mass production of more advanced chips using 1.4nm technology by 2027.

As demand for high-performance chips grows, competition in technology development is becoming increasingly fierce, especially between foundry leader TSMC and fast-growing Samsung.

Samsung said its most advanced chips, made with 2nm technology, have seen a 12% performance gain and a 25% increase in power efficiency over the 3nm chips launched last year.

At a recent event, Samsung announced that it has launched contract manufacturing services for 8-inch gallium nitride (GaN) power semiconductors, which are used in a variety of consumer, information technology and automotive applications. These services will be available in 2025.

In the first half of 2025, the company will begin production of 5nm radio frequency (RF) chips to support 6G networking technologies. These chips will offer a 40% increase in power efficiency over previous chips made with 14nm technology.

As ultra-thin chip manufacturing processes pose technological challenges, Samsung said it plans to utilize AI technologies in the chip manufacturing process to increase productivity and improve product quality.