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Electronics news

AIM will exhibit NC259FPA ultra-thin solder paste at SMTA Monterrey Expo & Tech Forum

AIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, announced its participation in the SMTA Monterrey Expo & Tech Forum, to be held March 14 in Hall A2 of the Cintermex Convention Center in Monterrey, Nuevo Leon, Mexico.

Among other products, AIM will showcase its recently released NC259FPA Ultrafine No Clean Solder Paste.

NC259FPA is a zero halogen paste designed for precision printing with Type 6 and smaller alloy powders through stencil holes less than 150 microns in diameter. The paste is ideal for mini-LEDs, micro-LEDs, die attach, micro BGAs and HDI boards. Features excellent wettability, high transfer efficiency, high reliability and high adhesion force for mass transfer.

To learn more about the NC259FPA and to experience all of AIM's products and services, visit the company at the SMTA Monterrey Expo & Tech Forum on March 14.