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Electronics news

How to improve heat dissipation in PCB design?

Designing heat dissipation is essential to ensure proper functioning of the PCB. Inefficient heat dissipation results in higher component temperatures, affecting performance and board life.

Heat sink design:
1. PCB design. Plan the spacing between components to ensure unobstructed airflow and avoid too dense wiring so as not to impede heat conduction and dissipation.
2. heat conduction:
- Use metal foil as a heat conductive material when connecting high-power components to heat sinks or metal substrates.
- Choose materials with good thermal conductivity for the substrate: aluminum or copper.
3. When selecting and designing heat sinks, consider the following factors:
- size and shape depending on power consumption and heat dissipation requirements;
- choose the material of the radiators depending on the specific requirements. Aluminum radiators have good heat dissipation and are lightweight, while copper radiators have higher thermal conductivity;
- install heatsinks near components on the PCB that generate a significant amount of heat to ensure fast heat transfer.
4. Heat dissipation fan. In heavy-duty PCB designs, the use of heat sinks alone may not be sufficient to dissipate heat. In such cases, consider using a fan to increase airflow and improve heat dissipation.