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Electronics news

New materials for printed circuit boards (PCBs)

Taking into account the elements described in the previous text, we can identify two key factors that determine the choice of material and substrate best suited for a particular application: maximum power and amount of heat.

Greater benefits can be achieved by using innovative materials:

Fluoropolymers - characterized by resistance to corrosion, mechanical stress and high temperatures.

Polyimide PI - has the ability to bend and wrap in tight spaces or irregularly shaped areas, resistant to heat and weathering.

Acrylic adhesives - have a high coefficient of expansion. At temperatures close to 180°C, acrylic adhesives begin to soften, leading to a risk of delamination of PCB layers in contact with conductive tracks.

Epoxy adhesives - form a rigid material and are therefore not suitable for many dynamic applications. Their low coefficient of expansion and high adhesion strength make them an excellent solution for multilayer PCBs that can withstand high operating temperatures. They are resistant to chemicals and absorb moisture well.

LCP liquid crystal polymers are lightweight and flexible, made of inert non-reactive material, have high flame resistance, exceptional electrical performance, good dielectric properties.