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Electronics news

New NC259FPA Solder Paste from AIM Solder

AIM Solder, the world's leading manufacturer of materials for the electronics industry, has developed the new NC259FPA Ultrafine No Clean Solder Paste.

The presentation took place recently at Productronica Germany.

NC259FPA is a T6 powder paste with zero halogen content. It is suitable for miniLED, microLED, micro BGA and HDI boards. Features excellent wettability, high transfer efficiency, reliability and adhesion force.

Advantages of NC259FPA:

- Excellent wettability;
- high shear strength;
- clean flux residue;
- nitrogen soldering recommended;
- halogen-free.