Ball Grid Array (BGA) provides reliable contact between the board and the chip, which improves device reliability and durability.
BGA types:
- uBGA (micro BGA). A chip with a small number of pins usually less than 100. Used in mobile devices and compact systems.
- FBGA (Fine-pitch BGA). A chip with a high density of pins spaced at 0.5 mm or less. Used in high-speed applications such as servers and telecommunications equipment.
- PBGA (Plastic BGA). A chip with a plastic package filled with a thermally conductive material. Provides improved heat dissipation.
- CSP (Chip-Scale Package). Microcircuit without housing, solder balls are applied directly to the surface of the integrated circuit. Have minimal size and weight.
BGA applications:
- Microprocessors and other computer components
- Memory (RAM, ROM, Flash)
- Graphics processors (GPU)
- Telecommunication equipment
- Medical devices
- Automotive electronics
Maintenance and repair. Because of its complex structure, BGAs require specialized equipment and skills for maintenance and repair. Rebolling, the process of resoldering beads, is a common method of repairing faulty BGA chips.
- uBGA (micro BGA). A chip with a small number of pins usually less than 100. Used in mobile devices and compact systems.
- FBGA (Fine-pitch BGA). A chip with a high density of pins spaced at 0.5 mm or less. Used in high-speed applications such as servers and telecommunications equipment.
- PBGA (Plastic BGA). A chip with a plastic package filled with a thermally conductive material. Provides improved heat dissipation.
- CSP (Chip-Scale Package). Microcircuit without housing, solder balls are applied directly to the surface of the integrated circuit. Have minimal size and weight.
BGA applications:
- Microprocessors and other computer components
- Memory (RAM, ROM, Flash)
- Graphics processors (GPU)
- Telecommunication equipment
- Medical devices
- Automotive electronics
Maintenance and repair. Because of its complex structure, BGAs require specialized equipment and skills for maintenance and repair. Rebolling, the process of resoldering beads, is a common method of repairing faulty BGA chips.