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Electronics news

MKS' Atotech will participate in ECTC 2024

At this year's 74th IEEE Electronic Components and Technology Conference (ECTC), MKS' Atotech will showcase its latest innovative products and services.

The packaging conference is organized by the IEEE Electronic Packaging Society in Denver, Colorado, and will be held at the Gaylord Rockies Resort & Convention Center from May 28-31, 2024.

Technology experts from a variety of fields will present their latest research on surface preparation critical to electrolytic copper deposition at Booth 422. The research confirms the importance of pretreatment for optimal results and compares stability in air between the new activator and traditional palladium systems. The research results demonstrate the practical stability and improved performance of the Cupraganth activator, which eliminates palladium from the electrolytic copper plating process.