Designing HDI PCBs requires consideration of several factors to ensure their performance, functionality and reliability.
Component layout and placement requires careful planning to maximize the limited board area and avoid interference.
- Keep track of minimum trace widths and spacing. HDI PCBs should have trace and spacing widths in the range of 2 mil (50 µm) or less.
- Pay attention to impedance control because HDI circuits utilize high-speed signals.
- Ensure efficient heat dissipation to prevent overheating.
- Select materials based on material characteristics such as dielectric constant, thermal properties, and mechanical strength.
All materials used in the fabrication and assembly of HDI PCBs can have a significant impact on signal performance and board reliability, especially the choice of substrate material.
- Keep track of minimum trace widths and spacing. HDI PCBs should have trace and spacing widths in the range of 2 mil (50 µm) or less.
- Pay attention to impedance control because HDI circuits utilize high-speed signals.
- Ensure efficient heat dissipation to prevent overheating.
- Select materials based on material characteristics such as dielectric constant, thermal properties, and mechanical strength.
All materials used in the fabrication and assembly of HDI PCBs can have a significant impact on signal performance and board reliability, especially the choice of substrate material.