Lead-free coatings are applied to exposed metal surfaces of printed circuit boards and electronic components to protect them from oxidation, facilitate soldering, and provide reliable electrical connections.
Lead-free coatings are designed to eliminate the use of lead, a toxic substance. Popular options for lead-free surface finishes are:
- Immersion Tin (ImSn)
- Immersion silver (ImAg)
- Immersion gold plating over nickel sublayer (ENIG)
- Organic solderability preservatives (OSPs)
- Nickel/Palladium/Gold (Ni/Pd/Au)
Selecting the appropriate lead-free surface treatment method is a critical decision that can significantly impact the performance, reliability and cost-effectiveness of electronic products.
- Immersion Tin (ImSn)
- Immersion silver (ImAg)
- Immersion gold plating over nickel sublayer (ENIG)
- Organic solderability preservatives (OSPs)
- Nickel/Palladium/Gold (Ni/Pd/Au)
Selecting the appropriate lead-free surface treatment method is a critical decision that can significantly impact the performance, reliability and cost-effectiveness of electronic products.