The printed circuit board is the heart of electronic devices. While some PCB assembly processes require only one technology, others require a combination of two or more technologies.
For example, many boards require a combination of through-hole technology (THT) and surface mount technology.
Traditional PCB assembly process:
- Solder paste application. This does not refer to THT assembly (a technology that installs electronic components into through-hole PCBs), but does refer to SMT technology (surface mount).
- Placement of components by hand or with the help of equipment. In THT assembly, components are placed by hand, which requires incredible precision. In the SMT process, components are placed on the board by robotic equipment.
- Reflow soldering. The board and all components are passed through a furnace that heats the solder, liquefies it, and ensures that the connections are formed. The board is then cooled down. The THT process does not require re-pouring of solder. Instead, the board is inspected and component placement is adjusted. In the SMT process, the board passes through a furnace that melts the solder paste, allowing it to flow as needed. The board then passes through a series of coolers, which causes the components to be secured in place.
- Insertion of parts with through holes. Soldering is done by hand or wave solder.
- Checking and cleaning off excess solder. Final inspection of the board, solder points and components.
Traditional PCB assembly process:
- Solder paste application. This does not refer to THT assembly (a technology that installs electronic components into through-hole PCBs), but does refer to SMT technology (surface mount).
- Placement of components by hand or with the help of equipment. In THT assembly, components are placed by hand, which requires incredible precision. In the SMT process, components are placed on the board by robotic equipment.
- Reflow soldering. The board and all components are passed through a furnace that heats the solder, liquefies it, and ensures that the connections are formed. The board is then cooled down. The THT process does not require re-pouring of solder. Instead, the board is inspected and component placement is adjusted. In the SMT process, the board passes through a furnace that melts the solder paste, allowing it to flow as needed. The board then passes through a series of coolers, which causes the components to be secured in place.
- Insertion of parts with through holes. Soldering is done by hand or wave solder.
- Checking and cleaning off excess solder. Final inspection of the board, solder points and components.