Capabilities overview

Layers count

2

8

12

50

FR-1

Y

FR-4

Y

FR-4 HiTg [FR-5]

Y

IMS. Aluminum base

Y

CEM-I

Y

CEM-III

Y

FCCL. Polyimide

Y

FCCL. PET

Y

HF CCL. PTFE

Y

XPC

Y

Arlon

Y

DuPont

Y

Isola

Y

ITEQ

Y

Nelco

Y

Panasonic

Y

Rogers

Y

Taconic

Y

TUC

Y

WANGLING

Y

Finishing coatings

— POS-63 (HASL)
— Lead-free tinning (HASL LF)
— Immersion gold (ENIG)

— Immersion gold (ENIG) / silver / tin

— POS-63 (HASL)
— Lead-free tinning (HASL LF)
— Immersion gold (ENIG) / silver / tin
— Graphite coating (CARBON)
— Organic coating (OSP)
— Gilding of blade connectors (Gold finger)
— Soft Gold (Ni ~ 2.5-6 microns / Au ~ 0.25-0.5 microns)
— Hard Gold (Ni ~ 2.5-6 microns / Au~ 1.25 microns)
— Combined HASL+ENIG / CARBON+ENIG
— ENEPIG new!

Aspect ratio PTH

—

10:1

12:1

20:1

Copper thickness outer

3 oz

4 oz

2 oz

28 oz

Copper thickness inner

—

1 oz

6 oz

28 oz

Board thickness

3 mm

0,3 mm

10 mm

Hole-wall copper

—

25 um

35 um

70 um

Board size for ≤ 2 layers

500x1200 mm

250x1500 mm

630х1200 mm

Board size for Multi-layers

—

250x450 mm

550х650 mm

610х1016 mm

Ø D closed by Geen SM

0,4 mm

Ø Via Drill

0,15 mm

0,1 mm

Ø Via Laser

—

0,075 mm

Annular Ring

—

100 um

75 um

50 um

Board thickness

0,4 mm

0,08 mm

0,4 mm

0,1 mm

Solder mask bridge

0,1 mm

0,075 mm

Track width/space

0,15 / 0,15 mm

0,1 / 0,1 mm

0,05 / 0,05 mm

Track & edge gap V-CUT

0,30 mm

—

0,30 mm

0,20 mm

Track & edge gap milling

0,20 mm

—

0,20 mm

0,15 mm

Warpage

±0,75% (it may be reduced to ±0.5% when approving the project)

Track width

± 20%

± 10%

Outline

± 0,12 mm

± 0,2 mm

± 0,1 mm

± 0,075 mm

Board thickness

± 10%

± 0,05mm

± 10%

± 0,1mm / ±8%

Ø Via PTH

—

± 0,075 mm

± 0,08 mm

± 0,075 mm

Ø Via NPTH

±0,1 mm

± 0,05 mm

Impedance

—

±10%

±5%

V-CUT line

± 10° / ± 0,4 mm

—

± 10° / ± 0,4 mm

± 5° / ± 0,2 mm

Milling

± 0,15 mm

-0,075 mm

White

Y

Super white

Y

Black

Y + matt

Y

Y + matt

Green

Y + matt

Y

Y + matt

Red

Y + matt

Blue

Y

Yellow

Y

Other used colors

EMI; coverlay

Orange; purple

Peelable SM

White

Y

Black

Y

Green

Y

Red

Y

Blue

Y

Yellow

Y

Other used colors

Grey

3D metallization

Y

Edge platting/gold platting

Y

Back-Drill Burred VIAs

Y

Blind & buried VIAs

Y

Cross blind-buried VIAs

Y

Cross blind-buried VIAs

Y

Countersink/counterbore hole

Y

Half-cutted/Castellated hole

Y

Laser Micro VIAs

Y

Press-fit hole

Y

Plugged VIAs

Y

Via-in-Pad Technology

Y

Asymmetric stack-up

Y

Hybrid stack-up (FR-4 + Rogers)

Y

Kapton tape

Y

LTCC

Y

Mirorred Alu

Y

Multicolor tech

Y

Peelable solder mask

Y

Silicone roll for Rigid-flex PCB

Y

Jump-scoring

Y

Z-Routing

Y

Press fit coin technology

Y

AOI for all inner layers

Y - 100%

Cross section

Y

E-test (Fixture or Flying Probe)

Y

High POT testing

Y - if needed

Impedance control ±10%

Y

Impedance control down to ±5%

Y

Y - if needed

Y

Humidity paper indicator

Y - if needed

Y

IPC A-600H

class 2

class 2-3

class 3

Outgoing test-report and COC

Y

With Test Coupon

Y - if needed