IPC's Advanced Packaging Symposium in Tokyo discussed cutting-edge advances and strategies shaping the future of packaging technology.
Opening remarks were delivered by IPC's President and CEO and a representative from NEC Corporation. The speaker for the event was Hidemichi Shimizu, Director of Device Industry and Semiconductor Strategy, Ministry of Economy, Trade and Industry, Japan. He emphasized Japan's role in driving innovation in the semiconductor industry. Conversations also centered on the future of artificial intelligence hardware based on advanced packaging, and AMD's corporate vice president spoke about the Japanese ecosystem spearheading this transformation.
A presentation by IPC's Chief Technology Officer for Advanced Packaging shed light on the organization's efforts to create an enabling environment for technological advancement and market growth.
IPC expressed its gratitude to the symposium participants and emphasized its commitment to supporting advanced packaging and the mutual exchange of ideas.
A presentation by IPC's Chief Technology Officer for Advanced Packaging shed light on the organization's efforts to create an enabling environment for technological advancement and market growth.
IPC expressed its gratitude to the symposium participants and emphasized its commitment to supporting advanced packaging and the mutual exchange of ideas.