The process starts with the preparation of copper surfaces.
A special organic complex is used to improve the adhesion of conductor layers to the copper surface. After that, the assembly of the inner layers begins. A prepreg consisting of glass fibers impregnated with resin is placed between each layer to provide mechanical strength and electrical insulation.
The assembled mold is loaded into a hot press. The layers are bonded together using induction heating. The mold is then cooled under the cold press. After that, the base holes are opened through all the layers of the board which are used to install the components. The board is then subjected to further processing including milling, electroplating, solder masking, silkscreening and other processes to produce a finished printed circuit board.
The assembled mold is loaded into a hot press. The layers are bonded together using induction heating. The mold is then cooled under the cold press. After that, the base holes are opened through all the layers of the board which are used to install the components. The board is then subjected to further processing including milling, electroplating, solder masking, silkscreening and other processes to produce a finished printed circuit board.