Laminating is accomplished by heating and pressurizing the layers of materials. It protects the conductive layers from the environment and also prevents short circuits between conductors.
- FR-4 is the most common laminate and provides a good balance between performance, cost and availability.
- CEM-1 is a more economical alternative to FR-4 but has some limitations in mechanical properties.
- Polyimide laminates have high thermal resistance and chemical resistance, making them suitable for flexible printed circuit boards.
- Metal clad laminates are used for metal core PCBs. They help to distribute and dissipate heat.
The PCB lamination process involves several steps. First, the surface of the panels is thoroughly cleaned to remove all dirt and oil. Next, micro-etching of the copper foil is done to ensure uniformity of the copper before lamination. This is followed by the application of adhesive material and bonding of the layers under heat and pressure. The final step is the curing of the adhesive material for the strength of the lamination.
- CEM-1 is a more economical alternative to FR-4 but has some limitations in mechanical properties.
- Polyimide laminates have high thermal resistance and chemical resistance, making them suitable for flexible printed circuit boards.
- Metal clad laminates are used for metal core PCBs. They help to distribute and dissipate heat.
The PCB lamination process involves several steps. First, the surface of the panels is thoroughly cleaned to remove all dirt and oil. Next, micro-etching of the copper foil is done to ensure uniformity of the copper before lamination. This is followed by the application of adhesive material and bonding of the layers under heat and pressure. The final step is the curing of the adhesive material for the strength of the lamination.